95% Alumina Thin Film Disc Ceramic Wafer Substrate for Sensor

• Customization: Available
• Application: Refractory, Industrial Ceramics
• Function: Wear Resistant
• Model NO.: G-E203
• Material: Porcelain Ceramic Plate
• Process: Porcelain Ceramic Plate
• Suppression Method: Unidirectional Pressurization
• Material1: 95 Alumina 99 Alumina Zirconia Ceramics
• Color: Ivory,Cream,White
• Useage: Thin Film Device
• Shape: Irregular Shape
• Surface Finish: Polished, Machined, Slot, Bore, Notch
• Working Temperature: 1400-1800c
• Synonyms: Aluminium Oxide, Alundum, Corundum, Alumina Oxide
• Size: Customers′ Requests
• Feature: Heat Resistance, Mechanical Strength, Abrasion Res
• Grain Size: 1-10um
• Purity: 95%
• Type: Ceramic Part
• Advantage: High Temperature and Chemical Corrosion,High Vacuu
• Application1: Used in Machinery, Electronics, Chemical Industry
• Transport Package: Carton
• Specification: CUSTOMIZED
• Trademark: Yunnuo
• Origin: China Shanghai
• HS Code: 8547100000
• Production Capacity: 500000 PCS/Year
• Package Size: 14.00cm * 9.00cm * 10.00cm
• Package Gross Weight: 0.500kg

Product Description

Product Description

Alumina substrates for thin film circuits

We can provide thin-film ceramic substrates,thin-film circuits and thick-film circuits. Advanced technology capability:powder modification,casting,sintering,CMP,sputtering,evaporation, photolithography, electroplating, etching, screen printing Isostatic pressure, laser cutting, etc

Alumina substrates for thin film circuits

We can provide thin-film ceramic substrates,thin-film circuits and thick-film circuits. Advanced technology capability:powder modification,casting,sintering,CMP,sputtering,evaporation, photolithography, electroplating, etching, screen printing Isostatic pressure, laser cutting, etc

*Professional suppliers of ceramic thin-film substrates

 

*Maintains strict process controls and testing parameters to ensure a consistent product on every lot providing optimal value and performance

 

*Advanced secondary processes like laser machining,polishing, and lapping
 

Characteristics:

Al2O3 %:≥99.6	Thermal Conductivity:≥30W/m.K@25ºC
Size:up to Dia. 8 inch	TCE:7.1 ppm/ºC(25-300ºC)
Thickness:0.05~2mm,±2%	Surface Finish :
Density:≥3.9 g/cm3	As fired:50-80nm/80-150nm
Water absorption %:0	Lapped:<300nm
Flexural strength:550 MPa	Polished:≤25nm
Dielectric Constant:9.9±0.1@10GHz	Volume Resistivity:≥1*1014 Ω.cm
Dielectric loss tangent:0.0001@10GHz	Dielectric Strength:≥15KV/mm

Size: Maximum Outer Dimensions 152.4mm. Outer Dimension ± 0.3mm. Typical Dimensions 50.8 *50. 8mm,76.2mm*76.2mm,101.6mm*101.6mm,OD 101.6mm Substrate thickness T:0.1- 3mm Grinding and Polishing Disc Thickness ±0.01 mm Typical thickness :0.127,0.254,0.381,0.508,0.635

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FAQ

Q1: How can know your quality?
We can send you samples or sample material for you to check or test.Let our physical samples speak loudly.
Q2:Are these samples free of charge?
Some standard small samples are free.If same as your requirements,we will just charge for mould to support.
Q3:If products are not to requirement,how can you do?
We will try our every best to solove it.Meeting your requirement is our mission.
Q4:What's the lead time?
Normally,for standard items,will ship within 1-10 days.For mass production order,we will finish within 30 working days after we receive payment.
Q5:Payment terms:
We can negotiate.