Customization: | Available |
---|---|
Feature: | Long Time Materials |
Refractoriness (℃): | 1770< Refractoriness< 2000 |
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Item
|
Unit
|
Data
|
Bulk density
|
g/cm3
|
2.75-2.82
|
Porosity
|
%
|
10-12
|
Compressive strength
|
MPa
|
600-700
|
Flexural strength
|
MPa
|
160-180
|
Young's modulus
|
Gpa
|
220-260
|
Thermal Conductivity
|
W/MK
|
15
|
Thermal expansion coefficient: 20-1000 ºC
|
10-6K-1
|
5.0
|
Maximum use temperature
|
C
|
1500
|
SiC
|
%
|
60-80
|
Silicon nitride
|
%
|
20-40
|
Item
|
Unit
|
Data
|
Bulk density
|
g/cm3
|
2.60-2.74
|
Porosity
|
%
|
15
|
Compression strength
|
MPa
|
≥600
|
Flexural strength
|
MPa
|
90-100
|
Young modulus
|
Gpa
|
240
|
Thermal conductivity
|
W/MK
|
24
|
Coefficient of thermal expansion 20-1000C
|
10-6K-1
|
4.8
|
Max using temperature
|
C
|
1650
|
SiC
|
%
|
98.5
|
Item
|
Unit
|
SSIC
|
Density
|
g/cm3
|
3.10-3.15
|
Hardness
|
HRA
|
92--94
|
Apparent porosity
|
%
|
<0.2
|
Compressive strength
|
Mpa
|
≥2200
|
Flexural strength
|
Mpa
|
≥400
|
Elastic Modulus
|
Gpa
|
400
|
Thermal conductivity (20 C)
|
W/m k
|
120--150
|
Thermal expansion coefficient
|
10 -6 1/c
|
4
|
Maximum use temperature
|
c
|
1600
|
Item
|
Unit
|
RBSIC
|
Bulk density
|
g/cm3
|
≥3.03
|
hardness
|
HRA
|
91--93
|
Apparent porosity
|
%
|
<0.2
|
Flexural strength
|
Mpa
|
≥350
|
Compressive strength
|
Mpa
|
≥2000
|
Thermal Conductivity
|
W/m k
|
50~110
|
Thermal expansion coefficient
|
10 -6 1/C
|
4
|
Elastic Modulus
|
GPa
|
350
|
Free silicon content
|
%
|
<12
|
Maximum use temperature
|
C
|
1000
|