High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate

Product Details
Customization: Available
Application: Refractory, Industrial Ceramics
Material: Industrial Ceramics
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  • High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
  • High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
  • High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
  • High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
  • High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
  • High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
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  • Overview
  • Product Description
  • Material data
  • Company Profile
  • Way of shipping
  • Our Advantages
  • FAQ
Overview

Basic Info.

Model NO.
G-E213
Process
Special Ceramic Plate
Pressing Speed
Punch Forming
Suppression Method
Unidirectional Pressurization
Color
White, Yellow, Pink, Cream
Useage
Thin Film Device
Shape
Round, Square, Rectangular, Cylindrical
Surface Finish
Polished, Machined, Slot, Bore, Notch
Working Temperature
1400-1800c
Synonyms
Aluminium Oxide, Alundum, Corundum, Alumina Oxide
Size
Customers′ Requests
Feature
Heat Resistance, Mechanical Strength, Abrasion Res
Grain Size
1-10um
Purity
95%
Type
Ceramic Part
Transport Package
Carton
Specification
CUSTOMIZED
Trademark
Yunnuo
Origin
China Shanghai
HS Code
8547100000
Production Capacity
500000 PCS/Year

Packaging & Delivery

Package Size
20.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

Product Description

Alumina substrates for thin film circuits

    We can provide thin-film ceramic substrates,thin-film circuits and thick-film circuits.Advanced technology capability:powder modification,casting,sintering,CMP,sputtering,evaporation, photolithography, electroplating, etching, screen printing Isostatic pressure, laser cutting, etc
 
*Professional suppliers of ceramic thin-film substrates*Maintains strict process controls and testing parameters to ensure a consistent product on every lot providing optimal value and performance*Advanced secondary processes like laser machining, polishing, and lapping
 

Characteristics
Al2O3 %:≥99.6
Thermal Conductivity:≥30W/m.K@25ºC
Size:up to Dia. 8 inch
TCE:7.1 ppm/ºC(25-300ºC)
Thickness:0.05~2mm,±2%
Surface Finish :
Density:≥3.9 g/cm3
As fired:50-80nm/80-150nm
Water absorption %:0
Lapped:<300nm
Flexural strength:550 MPa
Polished:≤25nm
Dielectric Constant:9.9±0.1@10GHz
Volume Resistivity:≥1*1014 Ω.cm
Dielectric loss tangent:0.0001@10GHz
Dielectric Strength:≥15KV/mm
Size: Maximum Outer Dimensions 152.4mm.
Outer Dimension ± 0.3mm.
Typical Dimensions 50.8 *50. 8mm,76.2mm*76.2mm,101.6mm*101.6mm,OD 101.6mm
Substrate thickness
T:0.1- 3mm
Grinding and Polishing Disc Thickness ±0.01 mm
Typical thickness :0.127,0.254,0.381,0.508,0.635
95% 99% 99.7% alumina ceramic substrate 

Application:
They are used in thick film circuits, ceramic metallization, ozone generators, audio, LED lighting, electronic insulation devices,solar new energy and other industries.

Features:
It has the characteristics of low dielectric loss, stable electrical performance, smooth surface, consistent thickness, good
flatness, and overall dimensions,ect.

Size:
The thickness can be produced from 0.25mm -----15 mm, and the ceramic substrate can be punched and lineated.

We can customize to your requirements. 
 
High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate
Material data
 
AL2O3%
60
75
80
85
92
95
99
99.7
Bulk Density (g/cm3)
3.0
3.1
3.3
3.4
3.6
3.7
3.81
3.91
Flexural strength (MPa)
205
280
215.7
230
312
304
340
370
Linear expansion coefficient (×10-6/C)(25-800C)
7.1
7.6
7.6
7.6
7.5
7.3
7.6
7.6
Thermal conductivity [w/(m.R)]
16
17
17
17
18
20
34
35
Dielectric strength (KV/mm)
10
10
10
10
10
10
10
10
Volume resistivity (Ω.cm) 20C
>1014
>1014
>10 14
>1014
>1014
>1014
>1014
>1014
300C
>1013
>1013
>10 13
>1013
>1013
>1012
>1010
>1010
Max C
1350
1100
1300
1350
1500
1600
1700
1800
Moh's hardness
7.5
7.5
7.5
7.5
8.5
8.8
9
9
Refractoriness
1800
1700
1800
1850
1920
2000
2030
2040
 
Length mm
Width mm
Thickness mm
3
10
1
22
20
0.8
100
50
1
4
4
1
50
20
0.8
100
100
0.5-1
80
80
2
88
77
8
8.4
7.5
0.635
150
75
1
152
135
1
150
100
0.6
Diameter mm
Thickness mm
 
50
0.5
 
80
2
 
100
2
 

High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate

High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate

Company Profile

High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB SubstrateHigh Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate

Way of shipping

High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate

Our Advantages

High Electronic Thin Film Polished 96% 99.6% Al2O3 Alumina Ceramic PCB Substrate

FAQ

Q1: How can know your quality?
We can send you samples or sample material for you to check or test.Let our physical samples speak loudly.
Q2:Are these samples free of charge?
Some standard small samples are free.If same as your requirements,we will just charge for mould to support.
Q3:If products are not to requirement,how can you do?
We will try our every best to solove it.Meeting your requirement is our mission.
Q4:What's the lead time?
Normally,for standard items,will ship within 1-10 days.For mass production order,we will finish within 30 working days after we receive payment.
Q5:Payment terms:
We can negotiate.

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