Ain Board Aluminum Nitride Direct Bond Copper Substrate

Product Details
Customization: Available
Application: Refractory, Industrial Ceramics
Material: 95 Alumina 99 Alumina Zirconia Ceramics
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Registered Capital
1000000 RMB
Plant Area
101~500 square meters
  • Ain Board Aluminum Nitride Direct Bond Copper Substrate
  • Ain Board Aluminum Nitride Direct Bond Copper Substrate
  • Ain Board Aluminum Nitride Direct Bond Copper Substrate
  • Ain Board Aluminum Nitride Direct Bond Copper Substrate
  • Ain Board Aluminum Nitride Direct Bond Copper Substrate
  • Ain Board Aluminum Nitride Direct Bond Copper Substrate
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  • Overview
  • Product Description
  • Material data
  • FAQ
Overview

Basic Info.

Model NO.
G-E150
Suppression Method
Unidirectional Pressurization
Name
Thick Film Circuit
Shape
Irregular Shape
Advantage
High Temperature and Chemical Corrosion
Working Temperature
1400-1800c
Usage
Industry Usage
Size
Customers′ Requests
Grain Size
1-10um
Purity
95%
Type
Ceramic Part
Transport Package
Carton
Specification
CUSTOMIZED
Trademark
Yunnuo
Origin
China Shanghai
HS Code
8547100000
Production Capacity
500000 PCS/Year

Packaging & Delivery

Package Size
15.00cm * 10.00cm * 10.00cm
Package Gross Weight
0.200kg

Product Description

Product Description

Ain Board Aluminum Nitride Direct Bond Copper SubstrateAin Board Aluminum Nitride Direct Bond Copper SubstrateAin Board Aluminum Nitride Direct Bond Copper SubstrateAin Board Aluminum Nitride Direct Bond Copper SubstrateAin Board Aluminum Nitride Direct Bond Copper SubstrateWe can provide thin-film ceramic substrates,thin-film circuits and thick-film circuits. Advanced technology capability:powder modification,casting,sintering,CMP,sputtering,evaporation, photolithography,electroplating,etching, screen printing,isostatic pressure, laser cutting, etc.

1.Electronic ceramic substrate
Size:
Maximum Outer Dimensions 152.4mm.
Outer Dimension ± 0.3mm.
Typical Dimensions
50.8 *50. 8mm,76.2mm*76.2mm,101.6mm*101.6mm,OD 101.6mm

Substrate thickness
T:0.1- 3mm
Grinding and Polishing Disc Thickness ±0.01 mm
Typical thickness :0.127,0.254,0.381,0.508,0.635

Ain Board Aluminum Nitride Direct Bond Copper Substrate
Ain Board Aluminum Nitride Direct Bond Copper SubstrateAin Board Aluminum Nitride Direct Bond Copper Substrate

2. Thin film circuit
Adopting precision processes such as sputtering, evaporation, and lithography, suitable for
producing high-density, small-sized, high-performance passive circuits, typical
products include precision resistors, chip capacitors, filters, power dividers, and electronics
Bridges, ferrite microstrip circuits, etc., widely used in RF, microwave, optical communication
Widely used in fields such as automotive electronics and medical electronics.
Ain Board Aluminum Nitride Direct Bond Copper Substrate
Basilar plate:alumina ceramic
Metal:sputtering Ti,TiW,TaN,Au,NiCr,Cu,Ni,Cr and Pt
electroplating: Cu, Ni, and Au
evaporation: AuSn, Pt

         
Material data
Item TaN NiCr
Resistance temperature coefficient(ppm/C-25 to 125C) -100±50 0±50
Resistor change rate(%,1000h@125C) 0.2 0.2
Maximum aging temperature C 450 350
Recommended use environment Air and an inert atmosphere 350 (<0.5 hours) Inert atmosphere or passivation layer coating 250
(<0.5 hours)
 
Common membrane lineage structure
Ain Board Aluminum Nitride Direct Bond Copper SubstrateSingle-layer Chip Capacitive (SLC)


Small size, high application frequency (up to 100GHz); It is mainly used for isolation and filtering in RF, microwave, and millimeter wave circuits.

Working temperature: -55 C~+85 C; The standard film system structure is TaN/TiW/Ni/Au, which meets various micro assembly process requirements such as adhesive, welding, and eutectic.

The withstand voltage value below 100pF is 100V, and the withstand voltage value above 100pF is 50V.
 
FAQ

Q1: How can know your quality?
We can send you samples or sample material for you to check or test.Let our physical samples speak loudly.
Q2:Are these samples free of charge?
Some standard small samples are free.If same as your requirements,we will just charge for mould to support.
Q3:If products are not to requirement,how can you do?
We will try our every best to solove it.Meeting your requirement is our mission.
Q4:What's the lead time?
Normally,for standard items,will ship within 1-10 days.For mass production order,we will finish within 30 working days after we receive payment.
Q5:Payment terms:
We can negotiate.

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