Professional Supply Integrated Circuit/Ics of Bom List Supporting Electronic Components

• Customization: Available
• Application: Refractory, Industrial Ceramics
• Grain Size: 1-10um
• Model NO.: G-E123
• Type: Ceramic Part
• Pressing Speed: Punch Forming
• Suppression Method: Unidirectional Pressurization
• Name: Thick Film Circuit
• Shape: Irregular Shape
• Advantage: High Temperature and Chemical Corrosion, High Vacuu
• Material: 95 Alumina 99 Alumina Zirconia Ceramics
• Working Temperature: 1400-1800c
• Usage: Industry Usage
• Size: Customers′ Requests
• Transport Package: Carton
• Specification: CUSTOMIZED
• Trademark: Yunnuo
• Origin: China Shanghai
• HS Code: 8547100000
• Production Capacity: 500000 PCS/Year

Product Description

Product Description

We can provide thin-film ceramic substrates,thin-film circuits and thick-film circuits. Advanced technology capability:powder modification,casting,sintering,CMP,sputtering,evaporation, photolithography,electroplating,etching, screen printing,isostatic pressure, laser cutting, etc.

1.Electronic ceramic substrate
Size:
Maximum Outer Dimensions 152.4mm.
Outer Dimension ± 0.3mm.
Typical Dimensions
50.8 *50. 8mm,76.2mm*76.2mm,101.6mm*101.6mm,OD 101.6mm

Substrate thickness
T:0.1- 3mm
Grinding and Polishing Disc Thickness ±0.01 mm
Typical thickness :0.127,0.254,0.381,0.508,0.635

2. Thin film circuit

Adopting precision processes such as sputtering, evaporation, and lithography, suitable for
producing high-density, small-sized, high-performance passive circuits, typical
products include precision resistors, chip capacitors, filters, power dividers, and electronics
Bridges, ferrite microstrip circuits, etc., widely used in RF, microwave, optical communication
Widely used in fields such as automotive electronics and medical electronics.

Basilar plate:alumina ceramic
Metal:sputtering Ti,TiW,TaN,Au,NiCr,Cu,Ni,Cr and Pt
electroplating: Cu, Ni, and Au
evaporation: AuSn, Pt

         

Material data

Item	TaN	NiCr
Resistance temperature coefficient(ppm/C-25 to 125C)	-100±50	0±50
Resistor change rate(%,1000h@125C)	0.2	0.2
Maximum aging temperature C	450	350
Recommended use environment	Air and an inert atmosphere 350 (<0.5 hours)	Inert atmosphere or passivation layer coating 250 (<0.5 hours)

 
Common membrane lineage structure
Single-layer Chip Capacitive (SLC)


Small size, high application frequency (up to 100GHz); It is mainly used for isolation and filtering in RF, microwave, and millimeter wave circuits.

Working temperature: -55 C~+85 C; The standard film system structure is TaN/TiW/Ni/Au, which meets various micro assembly process requirements such as adhesive, welding, and eutectic.

The withstand voltage value below 100pF is 100V, and the withstand voltage value above 100pF is 50V.
 

FAQ

Q1: How can know your quality?
We can send you samples or sample material for you to check or test.Let our physical samples speak loudly.
Q2:Are these samples free of charge?
Some standard small samples are free.If same as your requirements,we will just charge for mould to support.
Q3:If products are not to requirement,how can you do?
We will try our every best to solove it.Meeting your requirement is our mission.
Q4:What's the lead time?
Normally,for standard items,will ship within 1-10 days.For mass production order,we will finish within 30 working days after we receive payment.
Q5:Payment terms:
We can negotiate.