| Customization: | Available |
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| Application: | Refractory, Industrial Ceramics |
| Function: | Wear Resistant |
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Available Metallization&Plating Specifications
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Available Ceramic Compositions
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Al2O3 94%,97%,99.5%
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Available Metallization Materials
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Mo/Mn
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Metallization Thickness
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25±10um
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Available Plating Materials
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Ni/Ag/Au
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Plating Thickness
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2-10um
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Metallization Processing (See Process Description Below) |
Outer Diameter and Inner Diameter Banding
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Brush
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Screen Printing
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Spray
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Needle
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Base Metallization Materials
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Moly Manganese
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Tungsten Manganese
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Moly Tungsten Manganese
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Materials for Metallization
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Aluminum Oxide
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Beryllium Oxide (Restrictions Apply)
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Metallization Characteristics/Benefits
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Low Temperature Firing
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Universally Applicable
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Process Speed
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Uniform Coating, Thickness and Density
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No substrate deformation
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Intended Applications for Metallization Products
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Traveling Wave Tubes
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Vacuum Electronic Devices
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Medical Devices
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Photon Machines
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Neutron Generators
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X-Ray Tubes
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Klystrons
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High Vacuum Feed Through
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Relay Insulators
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E-Beam Technology
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